Conventional Tin-Lead and RoHS-Compliant Lead-Free Components

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1 While lead-frame and wire-bond packages can be provided as eutectic or lead-free, currently Altera flip-chip packages are RoHS compliant. We use Exemption #15 for the first Level Connections between the flip-chip die to the substrate (RoHS Exemption #15: Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within the integrated circuit flip-chip packages). For the remainder of this application note, the term Pb-free is used to refer to the BGA solutions provided with Pb-free package solder balls. This is considered the second Level Connections between the package and the PCBs.

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تاریخ انتشار 2010